Teplovodivá pasta Qoltec 4 W/m-K, 10 g, růžová

• Producer: Qoltec
• Thermal conductivity: 4 W/m-K
• Thermal resistance: 0.028 °C in²/W
• Specific gravity: 3.0–3.2
• Dielectric constants: 3.2 at 1 MHz
• Additional information: Loss on drying after 96 hours at 100°C: 0.005%
• Density: 3.0–3.1 g/ml
• Dielectric strength: 5.2 kV/mm
• Shelf life: 5 years
• Odour: Odourless
• Colour: Pink
• Operating temperature: -20˚C ~ +50˚C
• Dimensions (D/L x W x H): 32 x 32 x 33 mm
• Package: Plastic container
• Package contents: 1 x Thermal putty 10g

For electronic components requiring effective cooling: Effective heat dissipation and precise surface filling

Qoltec Thermal Putty 4 W/m-K is a thermally conductive compound designed to improve heat transfer between heat-generating electronic components and cooling elements. Thanks to its dense, malleable consistency, it conforms precisely to surfaces and fills minor irregularities and gaps, minimising the formation of air pockets that hinder heat dissipation.

• Thermal conductivity of 4 W/m-K

A thermal conductivity of 4 W/m·K facilitates the efficient transfer of heat to a heat sink or other component of the cooling system. The compound can be used with electronic components requiring improved thermal contact, including integrated circuits, memory modules, power supply sections and other heat-generating components.

Better thermal contact between the component and the heat sink: High thermal conductivity, excellent insulation and easy application

Qoltec thermal paste is a top-quality product that offers

high thermal conductivity of 4 W/m-K, ensuring effective heat dissipation,

• enhanced heat transfer between the component and the heat sink,
• high quality: the paste’s properties do not deteriorate over time, ensuring stable performance for years to come,

thick, malleable consistency, easy to apply, allowing you to precisely fill all micro-gaps between individual components,

• yield: net weight 10 g,
• Thick consistency, precise filling of gaps: The malleable consistency of Thermal Putty

Unlike traditional thin thermal paste, Thermal Putty has a thick and mouldable texture, allowing it to fill larger gaps between the component being cooled and the heat sink. It allows the layer of material to be precisely moulded to the shape of the surface and makes application easier in hard-to-reach areas.

• 10 g of product for servicing and technical applications

The pack contains 10 g of pink thermal paste, making the product suitable for both one-off repairs and more frequent servicing tasks. It is a practical solution for computer repair shops, electronics technicians and users involved in the maintenance and upgrading of equipment.

A thermal compound with a thermal conductivity of 4 W/m-K facilitates effective heat dissipation between a heating component and a heat sink. It is suitable for use with, amongst other things, processors, integrated circuits, electronic modules and other components requiring improved heat transfer. The material does not conduct electricity