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HP Z4 Memory Cooling Solution Bracket

HP Z4 Memory Cooling Solution Bracket
HP Z4 Memory Cooling Solution Bracket
2 377,58 Kč
The HP Z4 Memory Cooling Solution 56Q81AA is an accessory designed to improve thermal management of memory modules in HP Z4 workstations. It addresses heat dissipation for installed RAM to help maintain stable operating temperatures during sustained, memory-intensive workloads. The solution integrat... Zobrazit více

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The HP Z4 Memory Cooling Solution 56Q81AA is an accessory designed to improve thermal management of memory modules in HP Z4 workstations. It addresses heat dissipation for installed RAM to help maintain stable operating temperatures during sustained, memory-intensive workloads. The solution integrates with the workstation’s internal layout to direct air flow across DIMM slots and reduce thermal buildup on memory components.

Advantages

This memory cooling solution provides targeted cooling for DIMM modules, contributing to improved system stability during prolonged high-load conditions. By enhancing heat dissipation around memory components, it helps preserve performance consistency and can reduce the risk of thermal throttling. The design is aligned with HP Z4 workstation architecture to ensure compatibility and straightforward installation.

Suitable for

  • HP Z4 workstations requiring improved RAM thermal management
  • Workloads with sustained memory usage such as 3D rendering and scientific computing
  • Professional environments seeking consistent performance during long compute sessions

Key specifications

  • Product type: dedicated memory cooling accessory for workstation DIMMs
  • Compatibility: designed for HP Z4 workstation internal layout
  • Function: directs airflow across memory modules to improve heat dissipation
  • Intended use: installation inside chassis to support thermal management of RAM

How to use

Install the HP Z4 Memory Cooling Solution 56Q81AA inside the HP Z4 workstation following HP service instructions and safety procedures. Power down the system and disconnect from mains before opening the chassis. Position the cooling component over or adjacent to the DIMM slots as indicated in the workstation guide, secure it according to the provided mounting points, then reassemble the chassis and restore power. Verify that airflow is unobstructed and that the system boots normally; monitor memory temperatures under load to confirm improved cooling.

Recommendations

Use this cooling solution together with proper case airflow and manufacturer-recommended maintenance. Ensure RAM modules and sockets are installed correctly and keep vents clear of dust. For detailed installation steps and compatibility confirmation, consult HP Z4 service documentation or authorized support.

Hlavní vlastnosti
  • HP Z4 workstations requiring improved RAM thermal management
  • Workloads with sustained memory usage such as 3D rendering and scientific computing
  • Professional environments seeking consistent performance during long compute sessions
  • Product type: dedicated memory cooling accessory for workstation DIMMs
  • Compatibility: designed for HP Z4 workstation internal layout
  • Function: directs airflow across memory modules to improve heat dissipation
  • Intended use: installation inside chassis to support thermal management of RAM
Parametry
Barva produktu
Černá
Hloubka
254 mm
Hloubka balení
200 mm
Hmotnost
422 g
Hmotnost balíku
640 g
Obsah balení
Memory fan assembly; Install guide; Product notices; Warranty Card
Šířka
166 mm
Šířka balíku
295 mm
Typ
Bracket
Výška
138 mm
Výška balení
158 mm
Vývoj ceny za posledních 6 měsíců
HP Z4 Memory Cooling Solution Bracket
Aktuální
2 377,58 Kč
Nejnižší
2 364,95 Kč
Nejvyšší
2 467,35 Kč
Změna za 24 h
+3,44 Kč   +0%
Týden
-51,55 Kč   -2%
Měsíc
0,00 Kč   0%

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Prodávající: UAB KUR LT · Laisvės pr. 125A, LT-06118 Vilnius, Litva · IČO 303192950 · DIČ LT100008198612 · Odesíláme z EU (Litva)
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